Micropelt Peltier cooler chips offer new possibilities for the temperature control of fiber optics, photonics and sensor applications. Ultra-small dimensions and highest possible electrical impedance break with the boundaries of conventional TEC solutions.
Thanks to the patented wafer-based thin-film MEMS-like micro-structuring process, Micropelt’s micro-coolers offer the industry’s highest packing density of up to 50 thermoelectric leg pairs per mm².
In comparison with traditional TEC devices, the MPC-D403 / D404 operate at much lower control currents at higher voltages, enabling very power-efficient control circuits with less power-consumption & -dissipation.
When using the MPC-D403 / D404, the overall system power balance (TEC-control and DC/DC converter) will be more than 50 % better compared to a traditional TEC Peltier element.
Micropelt’s coolers offer the smallest feature sizes in the world, with the industry’s highest power density.
Micro-coolers of about 1 mm² are available to miniaturize state-of-the-art photonic components and are suitable for high-volume packaging processes.


Micropelt MPC-D403 chip on TO46 Header with NTC.
For emissionwavelength stabilization and temperature control of telecommunication lasers. » Learn more (PDF 809KB).