Micropelt Thermoelectric Simulation Tool
The Micropelt thermoelectric simulation tool «mypelt» is designed to simulate the use of Micropelt thermoelectric devices under your application conditions. To be able to use this tool, a Java Virtual Machine must be installed on your computer and the execution of Java applets must be activated in your browser. If the software is not installed on your system, you may download it from the » Sun Java download page (http://www.java.com/en/download/manual.jsp). The Windows Java Virtual Machine will also work. Once you have read the paragraph below, you may start the tool right away by clicking on the «mypelt» button – alternatively you may read the short introduction down below.
We aren’t lawyers, so let us put it this way: by using our thermoelectric simulation tool «mypelt», you agree that Micropelt and/or anyone associated with «mypelt» will not in any way be responsible for any damage, problem and/or loss of data that may result from using this software. «mypelt» is provided without any warranty. You may not redistribute «mypelt» without our written permission.
We have tried our best to provide you with a valuable tool. Should you discover a mistake or if you have a suggestion don’t hesitate to use the contact button below.
Short Introduction
To start the thermoelectric simulation tool for Micropelt thermoelectric devices, click on the «mypelt» button above. Select a device or device group from the top left corner:
Select a device:
Or a device group for Peltier cooler devices (TEC=MPC) or thermogenerator devices (TEG=MPG):
The thermoelectric material data used in the model have been taken from our actual devices. Since these parts are still under development, the material properties will improve in the near future. This concerns the Seebeck coefficient, the electrical conductivity and the thermal resistivity of our sputtered and annealed thermoelectric material.
The table below shows the geometrical dimensions of all the devices and includes links to available datasheets. You may order samples for all devices. For more information about the chips please contact us.
| Dimensions | |||||
|---|---|---|---|---|---|
| Device | Leg Pairs Total thickness |
Maximum cold_x cold_y hot_x hot_y |
Minimum cold_x cold_y hot_x hot_y |
Electrical resistance at 23 °C Thermal resistance at 85 °C |
ΔTmax Qmax Imax all at 85 °C |
| » MPC-D303 (PDF 1003 KB) | 4 1090 µm |
1180 µm 832 µm 2142 µm 832 µm |
1080 µm 732 µm 2042 µm 732 µm |
0.3 Ω 135 K/W |
48 K 0.33 W 1.2 A |
| » MPC-D303-HPHigh performance version (PDF 820 KB) |
4 1090 µm |
1180 µm 832 µm 2142 µm 832 µm |
1080 µm 732 µm 2042 µm 732 µm |
0.3 Ω 135 K/W |
61 K 0.33 W 1.2 A |
| » MPC-D305 (PDF 1003 KB) | 3 1090 µm |
940 µm 832 µm 1666 µm 832 µm |
840 µm 732 µm 1566 µm 732 µm |
0.3 Ω 175 K/W |
40 K 0.23 W 1.0 A |
| MPC-D601 | 56 1070 µm |
2500 µm 2500 µm 3375 µm 2500 µm |
2450 µm 2450 µm 3325 µm 2450 µm |
2.5 Ω 6.5 K/W |
35 K 6.1 W 1.7 A |
| » MPC-D701(PDF 602 KB) | 108 1090 µm |
3388 µm 3364 µm 4248 µm 3364 µm |
3338 µm 3314 µm 4198 µm 3314 µm |
6.5 Ω 6.5 K/W |
42 K 6.3 W 1.2 A |
| Dimensions | |||||
|---|---|---|---|---|---|
| Device | Leg Pairs Total thickness |
Maximum cold_x cold_y hot_x hot_y |
Minimum cold_x cold_y hot_x hot_y |
Electrical resistance at 23 °C Thermal resistance at 85 °C |
Net Seebeck Voltage at 23 °C |
| » MPG-D602(PDF 686 KB) | 450 1070 µm |
2500 µm 2500 µm 3375 µm 2500 µm |
2450 µm 2450 µm 3325 µm 2450 µm |
200 Ω 12.0 K/W |
100 mV/K |
| » MPG-D751(PDF 686 KB) | 540 1090 µm |
3388 µm 3364 µm 4248 µm 3364 µm |
3338 µm 3314 µm 4198 µm 3314 µm |
300 Ω 12.5 K/W |
140 mV/K |
The chip size is given without size losses due to sawing as maximum dimensions, dimensions after sawing are given as miminum dimensions. Sawing loss is less than 100 µm. Backside metallisation if available is Ti/Pt. Included within «mypelt» is also a high performance version of the MPC–D303.
We provide support for mounting the devices in existing environments.
Once you have selected a device or a device group you may change the application conditions, such as ambient temperature, load temperature and heat load by moving the sliders, or by typing in the values.
To switch temperature units between Celsius, Kelvin and Fahrenheit, simply press the button.
The default values for the thermal resistances in the bottom left corner are typical values for a solder joint. There are two different influences: thermal resistances due to the connection of the chip to the heat sink and the thermal resistance of the heat sink. More details about this topic, which is crucial for the performance of the device, can be found in the «Electronics Cooling» article about » thermal interface materials. To edit the values press the edit button.
The values may now be edited. To accept the changed values, press OK.
To choose between different view plots, select the required tab.
