Cooling and Temperature Control
Micrometer Dimensions
Micropelt thermoelectric Peltier coolers (TECs) provide high-power densities and fast response times in scalable millimiter sized chips and are suitable for thermal management solutions in many existing and new applications.
Semiconductor manufacturing is base for Micropelt’s capability to scale TECs to customer specific application requirements and dimensions. Not any other Peltier production technology in the world is able to offer such scalability in chip size dimensions.
By the high-power density and ultrasmall thermal mass, the response times are extremely fast and open attractive scenario’s for fast and accurate temperature control, also for products which were not using active cooling for reasons of cost, size and power dissipation in the past.
MPC-D30x family delivers a cooling function in the worlds smallest TEC dimensions, matching the continuous drive to miniaturization of devices, like TO and Transmitter Optical Subassembly (TOSA) packages.
Very fast temperature control or cycling and precision temperature control with one to ten Watt heat power is supported by the MPC-D701, suitable as thermal management solution for many applications.
The MPC-D40x Family
The latest generation of TECs, the MPC-D40x series, operates at TEC system power efficiencies of 90 % and better by its low control currents. The MPC-D40x integrates 50 thermocouples on a square millimeter footprint, resulting in an electrical resistance of over 30 Ω, fitting perfect to integration inside low power optoelectronic and sensor packages. The TEC drive currents can be a factor of ten times smaller compared to similar bulk TECs whose few thermocouples results in an electrical resistance of below one Ohm and so a drive current well above one Ampere.
For low power TECs the drive current is a key parameter to contribute a high power efficient cooling system. Cutting drive currents by 90 %, compared to alternative TEC technologies, the overall cooling efficiency can be improved by 50 %. Buck regulators, as base of the TEC control system, can provide very good efficiency levels at small current levels, consuming less energy and producing less heat.
More details on Micropelt TECs can be found at the product overview page.
The following diagrams show the performance of a Micropelt thin film Peltier cooler component MPC-D303. The first diagram shows the net cooling. We also produce » thermogenerator components using the same technology.
Find the ΔT at your operating temperature.
Micropelt Peltier Coolers
| Device | Foot print x y Total thickness |
Electrical resistance at 23 °C |
ΔTmax Qmax Imax all at 85 °C |
Features |
|---|---|---|---|---|
| » MPC-D303 (PDF 1003 KB) | 2142 µm 832 µm 1090 µm |
0.3 Ω | 48 K 0.33 W 1.2 A |
World’s smallest coolers Ideal for miniaturization |
| » MPC-D305 (PDF 1003 KB) | 1666 µm 832 µm 1090 µm |
0.3 Ω | 40 K 0.23 W 1.0 A |
World’s smallest coolers Ideal for miniaturization |
| » MPC-D403 (PDF 918 KB) | 2000 µm 1000 µm 1090 µm |
23 Ω | 54 K 0.67 W 0.24 A |
High electrical impedane Low control currents Maximum power efficiency Ideal for laser optics and photonics |
| » MPC-D404 (PDF 918 KB) | 1560 µm 1000 µm 1090 µm |
28 Ω | 53 K 0.59 W 0.21 A |
High electrical impedane Low control currents Maximum power efficiency Ideal for laser optics and photonics |
| » MPC-D701(PDF 702 KB) | 4248 µm 3364 µm 1090 µm |
6.5 Ω | 42 K 6.3 W 1.2 A |
High power densitiy Ideal for rapid temperature cycling |
The chip size is given without size losses due to sawing as maximum dimensions. Sawing loss is less than 100 µm. Backside metallisation if available is Ti/Pt.
We provide support for mounting the devices in existing environments.
Micropelt Peltier Cooler Definitions
Micropelt GmbH
Emmy-Noether-Str. 2
79110 Freiburg
Elisabeth Frey
Phone: +49 (0) 761 156 337 0
Fax: +49 (0) 761 156 337 21
